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1. Strong magnetic automatic positioning function, built-in strong magnetic adsorption, precise alignment without offset.
2. Leakage tin barrier design, equipped with a leak-proof tin tin plate, and the mobile phone motherboard is protected from damage.
3. Special grade steel mesh material, high temperature resistance of 500 degrees Celsius, no bulging, no deformation.
4. Intelligent value tin, powerful functions are integrated, easy to operate.
5. Suitable for iPhone X / XS / XS Max / 11 / 11 Pro / 11 Pro Max
2. Leakage tin barrier design, equipped with a leak-proof tin tin plate, and the mobile phone motherboard is protected from damage.
3. Special grade steel mesh material, high temperature resistance of 500 degrees Celsius, no bulging, no deformation.
4. Intelligent value tin, powerful functions are integrated, easy to operate.
5. Suitable for iPhone X / XS / XS Max / 11 / 11 Pro / 11 Pro Max
Specification:
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